Allegro MicroSystems - 功率 IC 封装组合

Contact Us

Please use the form below to contact us with regards any questions you may have. We will endeavour to respond to you as quickly as we can. Please continue to browse the site for any other information in the meantime.

Required*

This field is required

First name *

This field is required

Last Name *

Please enter a valid Email Address

Business Email *

Phone number

This field is required

Job Title *

This field is required

Company *

This field is required

Country *

This field is required

State/ Province *

This field is required

Postal / Zip Code *

Comments

Stay informed about Allegro news, events and offers. You can review our opt-in messaging details in our Privacy Notice

This field is required

By selecting “confirm” you grant Allegro permission to process your data and send you information. *

整合电路

Allegro MicroSystems 公司是开发、制造和营销高性能功率整合电路和整合式霍尔效应磁传感器 IC 的领导者。Allegro 创新的解决方案在汽车、通信、计算机/办公室自动化、消费者和工业市场中的应用不断增加。

Allegro 的功率封装可提供行业领先的热性能且占用极小的电路板空间。

TSSOP – 带可选隔热片行业标准的 TSSOP 封装，以提高散热性

QFP – 带隔热片的通用四型封装，以提高散热性能

QFN/TDFN – 带隔热片的四型和双型纤薄表面安装封装，以提高散热性能

MSOP – 行业标准的微型纤薄封装

SOIC – 带某些隔热片型号的纤薄整合电路，以提高散热性能

CSP – 晶片级芯片级

此外，还可以使用其它行业标准封装选项以满足具体的设计要求。以下封装选项是 Allegro 最近高技术封装的概述。

Contact Us

Thank You!

Form Unavaiable

功率 IC 封装组合

整合电路