Allegro MicroSystems - 功率 IC 封装组合

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整合电路

Allegro MicroSystems 公司是开发、制造和营销高性能功率整合电路和整合式霍尔效应磁传感器 IC 的领导者。Allegro 创新的解决方案在汽车、通信、计算机/办公室自动化、消费者和工业市场中的应用不断增加。

Allegro 的功率封装可提供行业领先的热性能且占用极小的电路板空间。

TSSOP – 带可选隔热片行业标准的 TSSOP 封装，以提高散热性

QFP – 带隔热片的通用四型封装，以提高散热性能

QFN/TDFN – 带隔热片的四型和双型纤薄表面安装封装，以提高散热性能

MSOP – 行业标准的微型纤薄封装

SOIC – 带某些隔热片型号的纤薄整合电路，以提高散热性能

CSP – 晶片级芯片级

此外，还可以使用其它行业标准封装选项以满足具体的设计要求。以下封装选项是 Allegro 最近高技术封装的概述。