Power IC Package Portfolio

Integrated Circuits

 
Allegro MicroSystems is a leader in developing, manufacturing and marketing high-performance semiconductors. Allegro's innovative solutions serve high-growth applications within the automotive market, with additional focus on office automation, industrial, and consumer/communications solutions.

Allegro’s power IC packages offer industry-leading thermal performance with limited board space.

• TSSOP – Industry-standard TSSOP with optional exposed pad for enhanced thermal performance
• QFP – Universal quad flat pack with exposed pad for enhanced thermal performance
• QFN/TDFN – Quad and dual, low-profile, surface-mount packages with exposed pad for enhanced thermal performance (wettable flank options available)
• MSOP – Industry-standard miniature small outline package with optional exposed pad for enhanced thermal performance
• SOIC – Small outline integrated circuit with optional exposed pad for enhanced thermal performance
• CSP – Wafer level chip scale

Additional industry-standard packaging options are available to meet individual design requirements. 

To view a sampling of Allegro’s most recent, high technology packages click here.