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我们完全集成的高隔离电流传感器解决方案系列可以极低的电阻提供精确测量 — 完全无需外部隔离元件。
Allegro 的专有封装使用倒装芯片技术，可在无芯封装设计中产生极佳的磁耦合效果。我们的解决方案还提供高达 4800 VRMS 的电隔离。这些纤薄、外形小巧的封装适合减少 PCB 在感应电阻运算放大器或大型电流变换器配置中的占用面积。
