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  1. Homepage /
  2. インサイトとイノベーション /
  3. Semiconductor Packaging Publications
Semiconductor Packaging Publications

Semiconductor Packaging Publications

  • Package Designators (PDF)
  • Package Dimensions 
  • Package Thermal Characteristics (PDF)
  • Back-Biased Packaging Advances 
  • Chemical Exposure of Devices
  • Guidelines for Designing Subassemblies Using Hall-Effect Devices (PDF)
  • Improving Batwing Power Dissipation (PDF)
  • Procedure for Measuring Pad-to-Ambient Thermal Resistance (RθPA) for Exposed Pad Packages (PDF)
  • Soldering Methods for Allegro's Products — SMD and Through-Hole 
  • Thermal Design for Plastic Integrated Circuits (PDF)
  • Wettable Flank Plated PQFN
  • Guidelines for Leadforming Using Back-Biased Hall-Effect Devices 
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製品

  • センサー
  • レギュレート
  • ドライブ
  • Emerging Technologies

用途

  • 自動車
  • 工業
  • エネルギーとインフラストラクチャ
  • コンシューマー

設計サポート

  • 設計と開発
  • 評価キットおよびデモ ボード
  • パッケージング
  • 品質基準および環境保証について
  • ソフトウェア ポータル

技術リソース

  • Resource Center
  • Technology Solutions

Allegro について

  • 私たちの会社
  • キャリア
  • 企業責任
  • Growth and Inclusion
  • お問い合わせ先

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