Precision Angle Sensor IC with Integrated Diagnostics for Safety-Critical Applications

A1333

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The A1333 provides high-resolution angle measurements with integrated diagnostics for safety-critical applications. Supports various output formats (UVW, ABI, SPI, PWM) and on-chip EEPROM for flexible configuration.

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Contactless 0° to 360° angle sensor IC, for angular position, rotational speed, and direction measurement
- Capable of sensing magnet rotational speeds targeting 12b effective resolution with 900 G field
- Circular Vertical Hall (CVH) technology provides a single channel sensor system supporting operation across a wide range of air gaps
Developed in accordance with ISO 26262:2011 requirements for hardware product development for use in safety-critical applications (pending assessment)
High diagnostic coverage
- On-chip diagnostics include logic built-in self-test (LBIST), signal path diagnostics, and watchdogs to support safety-critical applications
- 4-bit CRC on SPI
On-chip EEPROM for storing factory and customer calibration parameters
- Single-bit error correction, dual-bit error detection through the use of error correction control (ECC)
Supports harsh operating conditions required for automotive and industrial applications, including direct connection to 12 V battery
- Operating temperature range from –40°C to 150°C
- Operating supply voltage range from 4.0 to 16.5 V
  - Can support ISO 7637-2 Pulse 5b up to 39 V
Multiple output formats supported for ease of system integration
- ABI/UVW output provides high resolution, low latency, and PWM for initial position
- 10 MHz SPI for low latency angle and diagnostic information; enables multiple independent ICs to be connected to the same bus
- Output resolution on ABI and UVW are selectable
Multiple programming / configuration formats supported
- The system can be completely controlled and programmed over SPI, including EEPROM writes
- For system with limited pins available, writing and reading can be performed over VCC and PWM pins. This allows configuring the EEPROM in production line for a device with only ABI/UVW and PWM pins connected.
Stacked dual die construction to improve die-to-die matching for systems that require redundant sensors
Reduces magnet misalignment impact on die-to-die matching for a given magnet diameter, relative to “side-by-side” dual die orientation